Item |
Technical Sepecification |
Standard |
Advanced |
Base Material |
TG135: S1141 , KB6160 (CTI175-249) |
Halogen free-TG135(CTI175-249) |
TG150: KB6165 (CTI175-249) |
S1141, Rogers RO4003/4350 |
TG170: S1000-2, KB6167 (CTI175-249) |
/ |
Number of layer |
2-8 Layers |
10-12Layers |
Finished Board Thickness |
HASL |
0.6mm ~ 3.2mm |
|
OSP / Immersion Gold/ Tin/ Sliver |
0.40 mm~3.2 mm |
|
Finished Board Thickness |
1 or 2 layers |
HASL : 0.6mm ~ 3.2mm |
|
OSP / Immersion Gold/Tin/Sliver : 0.40 mm~3.2 mm |
|
4 Layers |
Min: 0.6 mm |
|
6 layers |
Min: 0.8 mm |
|
8 layers |
Min: 1.0mm |
|
Finished Board Thick tolorance |
≤1.0mm : +/-0.1mm |
/ |
>1.0 mm : +/-10% |
/ |
Copper Thickness |
inner layer |
Min : 1/2oz , Max : 4 oz |
4 oz < thickness ≤5oz OR Asymmetric copper |
outer layer |
Min : 1oz , Max: : 4 oz |
4 oz < thickness ≤5oz |
Surface Treatment and thickness |
HASL |
Pad size < 20 mm x 20mm : 2-40 um |
/ |
Pad size ≥ 20 mm x 20mm : 0.4-40 um |
/ |
OSP |
0.2-0.5um |
/ |
Immersion Silver |
0.2-0.4um |
/ |
Immersion Tin |
0.8-1.5um |
/ |
Immersion Gold |
Au:0.025-0.075um; Ni : 3-8um |
Au:0.075-0.127um; Ni:3-8um |
Gold finger |
/ |
Au:0.1-1.27um |
Solder mask |
Color |
Green、Black、White、Yellow、Blue、Red、Matte Green、Matte Black、Matter Red、Matter Blue、Purple、Clear、Different color between top and bottum |
/ |
Type |
KSM / PSR2000 / PSR4000/ LB-9000 / PM-500WD-97SF |
|
bridge |
min 0.1mm (4mil) |
|
Silkscreen |
color |
Green/ Black/ White/ Yellow/ Blue/ Red/ Matte Green/ Matte Black/ Matter Red/ Matter Blue/ Purple/ Clear/ Gray Different color between top and bottum |
|
Panel size |
600*600(Max) |
600*650mm(Max) |
Pcs size |
Min.10mm :With tooling hole (hole size 1.5-5.5mm) |
/ |
PCS Count Per Panel |
0-100 PCS/SET |
|
Rate of X-out |
Single Set |
≤20% |
|
All SET |
≤20% |
|
All PCS |
≤4% |
|
Minimum Core Thickness |
0.1mm(4mil) |
|
Drill types |
Drill Groove, Vias with Epoxy, Vias with Soldermask , Press Fit Hole, Castellated Holes, |
|
Holes |
Drill Groove |
Groove width : PTH :Min 0.5mm ; NPTH : Min 0.6 mm |
|
Vias with Epoxy |
Min 0.2mm , Max 6.5mm |
|
Vias with Soldermask |
Min 0.2mm , Max 0.65mm |
|
Press Fit Hole |
Min 0.4mm , Max 1.5mm ; Tolorance :+/- 0.05mm ; ( Require: 20um ≤ average hole copper thickness≤25um; 1oz ≤ outer layer copper thickness ≤ 2oz) |
1. Hole size > 1.5mm ; 2. 25um ≤ average hole copper thickness≤30um |
Countersink |
Deepth Tolerance ±6mil |
|
Angel 82°/ 90°/ 100° ; Angel Tolerance ±10° |
|
Castellated Holes |
Min.0.6 mm |
Min 0.5mm , Max 0.6mm |
Aspect ratio |
≤8:1 |
8:1< Ratio ≤10:1 |
Hole Copper Thickness (average) |
Min.20um(0.8mil) Max 30um(1.2mil) |
Min.30um(1.2mil) Max.40um(1.6mil) |
Tolorance of Drill size |
PTH |
+/- 0.075 mm |
|
NPTH |
+/- 0.05 mm |
|
≥ 6.5mm |
|
+/- 0.15 mm |
Hole position tolerances |
+/- 2 mil |
/ |
Inner Via/ Line (Original Gerber) |
4 Layers: 6mil ; 6 Layers: 7mi ; 8 Layers :8mil (Based on 1 oz ,For every extra ounce, add 2mil) |
|
Outer Via/ Line (Original Gerber) |
7 mil |
|
Holes between Different Networks (Finished) |
Min: 8 mil |
|
Holes in the Same Network (Finished) |
Min: 6 mil |
|
Inner Line Width/ Space (Original Gerber) |
0.5/0.5 oz:4/4mil; 1/1 oz:4/4mil; 2 / 2 oz : 6/6mil; 3/3OZ:8/8mil |
|
Outer Line Width/ Space (Original Gerber) |
1 / 1oz:4/4mil; 1.5/1.5oz:5/5mil; 2 / 2oz:6/6mil; 2.5/2.5oz:8/8mil; 3 / 3oz:9/10mil; 3.5/3.5oz:10/11mil; 4 / 4oz:11/12mil; |
|
Tolorace of line Width |
+/- 20% |
|
Single Side Width of PAD Ring (Finished) |
Based copper thick 0.5/0.5 oz |
Via hole 3mil ; Plug Hole 5mil |
|
Based copper thick 1/1oz |
Via hole 5mil ; Plug Hole 6mil |
|
Based copper thick 2/2oz |
Via hole 3mil ; Plug Hole 5mil |
|
Based copper thick 3/3 oz |
Via hole 5mil ; Plug Hole 6mil |
|
The Diameter of BGA PAD(Original Gerber) |
FInished Copper Thick 1/1 oz |
HAL 12 mil, Others Min 10 mil |
|
FInished Copper Thick 1.5/1.5oz |
HAL 14 mil, Others Min 12 mil |
|
Impedance |
Value And Tolorace |
Min.50Ω ± 10% |
|
Groups |
≤ 6 |
>6 |
Coil Boards (No inductance requirement) |
Copper thick 1oz |
Min Line width / space : ENIG 6/6mil; HAL 8/8mil; (≤8 Loops) |
|
Copper Thick 2 oz |
Min Line width / space : ENIG 8/8mil; HAL 9/9mil; (≤8 Loops) |
|
Guard Ring Width of Inner Layers |
8 mil |
|
Solder Mask Window |
Single Side Width Min. 2 mil |
|
Thickness Of Solder Mask |
5-25um |
1 stratum |
|
25.1-50um |
2 Stratum or Min thickness Requirement |
|
Solder Mask Text Of Different Surface Tratement |
HAL, Min.0.25mm×0.8mm |
|
Others, Min.0.2mm×0.8mm |
|
Width of Solder Mask Bridge |
Green, Clear |
1oz 4mil ; 2oz 5mil ; 3oz 6mil ; 4oz 8mil |
|
Yellow, Black, Blue, Red, White, |
1oz 6mil ; 2oz 7mil ; 3oz 8mil ; 4oz 10mil |
|
Matt Green,Matt Blue, Pruple |
1oz 6mil ; 2oz 7mil ; 3oz 8mil ; 4oz 10mil |
|
Matt Black |
1oz 6mil/ 2oz 8mil/ 3oz 10mil/ 4oz 10mil |
|
Silkscreen text Width / Height |
28 x 5 mil (≥ 6:1) |
|
Slot |
Slot size tol.Min.08mm |
PTH Slot Tolorance: +/-6mil |
/ |
NPTH slot Tolorance: +/-5mil |
Tolorance OF Outline Dimension |
±0.1mm (4 mil) |
/ |
Minimum spacing between hole edge to circuitry pattern |
Inner layer |
Min.10mil |
|
Outer layer |
Min.8mil |
|
V-cut |
Board Thickness |
min0.50mm(20mil). |
|
Groove Angle |
20°,30°,45°,60° |
|
Groove center to Trace |
≥0.4mm (Board Thickness : 0.5mm -0.6mm) |
|
Groove center to Trace |
≥0.6mm (Board Thickness : 1.6mm -3.0mm) |
|
Board Thickness : 0.5mm -0.6mm |
Remain Thickness: 0.3 +/- 0.10 mm |
|
Board Thickness : 0.6mm- 0.8mm |
Remain Thickness: 0.3 +/- 0.10 mm |
|
Board Thickness : 0.8mm -1.6mm |
Remain Thickness: 0.4 +/- 0.10 mm |
|
Board Thickness : 1.6mm -3.2mm |
Remain Thickness: 0.5 +/- 0.10 mm |
|
Multilayer |
Min. board thickness |
4layers:0.60mm |
|