Professional Rigid PCB manufacturer-Focus on service for trading companies

$ 0 NRE, $ 0 Samples, 30 credit days from the first order!

If you need a reliable rigid PCB manufacturer for a long-time company/ business strategy, you really come to the right place.
As a brand rigid PCB manufacturer, HX Circuit has specialized in this industry for over 10 years. HX has partners from more than 50+ countries and areas.

HX Circuit produces all the products in-house. Samples are produced in HX quick turn PCB factory while all ≥3 m² orders are produced by HX mass production  PCB factory.

Not only could HX provide the printed circuit boards fitting your requirements, but could also supply a different customer experience.
7S factory management, 96.8% on-time delivery, the b4-sale service, ISO 9001/ ISO 14001 Certificated, etc. HX has IATF certification and can offer PPAP.

Brand PCB Board Manufacturer

As an industrial group, HX Circuit is a brand rigid PCB manufacturer. It has 4 parts, 

Headquarters:7 floor, Huachuangda YiJing Building, 45 District,
Bao’an District, Shenzhen, CN
Samples PCB Factory:Huachuangda YiJing Building, 45 District,
Bao’an District
≥3 m² Orders PCB Factory:Bld3 Xinda Circuit Science and Technology Park,South of Luyuan Avenue West of Industrial Park, Xinfeng county
Delivery Wearhouse:Tianchen Bld, Xinhe Road, Bao’an District

More about HX Circuit
Found in 2010
Factory 129,100 ft²
Investment $ 20,300,000
Capability 3,850,000ft²
Rigid PCB
2-8 Layers
FR4 Material
Mass Production
Control/ Network
ISO 9001/ ISO 14001

Things we have to know

$ 0 NRE

≥1 m² Orders

  • For all ≥3 m² new orders
  • For all ≥1 m² transferred orders.
  • Rigid PCB, FR-4
PCB manufacturer 0 nre
$ 0 Samples

Free Samples

  • 24 hours quick turn
  • Based on Mass production
  • $ 0 Shipping Cost
30 Credit Days

From 1st order

  • For all customers
  • For all orders
  • From the delivery date

On-time delivery

  • Nearby Shenzen Port
  • By Express/ Air/ Sea
PCB MANUFACTURER on time deliverys

7S System

PCB Factory Mgt


On Time Delivery


After-sale Service

2 -8 Layers

Rigid PCB


Large-scale Customers



24 hours

Quick Turn

11 Years+ years


PCB Factory- circuit board manufacturing capabilities

As an experienced PCB board manufacturer, the range of products is from bare printed circuit boards to 12 layers, focusing on 2- 8 layers with IATF certification.

HX has advantages for heavy copper items boards. And many of our long-time cooperation items are from EMS companies and manufacturing factories.

HX always supplies free sample services for their mass production. And also offer 7/24 after-sale service. For auto PCBs, HX can offer PPAP. If you have any questions or suggestions about our PCB manufacturing service/ factory/ products, please do let us know.

We share the PCB manufacturing service capabilities here.

Item Technical Sepecification
Standard Advanced
Base Material TG135: S1141 , KB6160 (CTI175-249) Halogen free-TG135(CTI175-249)
TG150: KB6165 (CTI175-249) S1141, Rogers RO4003/4350
TG170: S1000-2, KB6167 (CTI175-249) /
Number of  layer 2-8 Layers 10-12Layers
Finished Board Thickness HASL 0.6mm ~ 3.2mm  
OSP / Immersion Gold/ Tin/ Sliver 0.40 mm~3.2 mm  
Finished Board Thickness 1 or 2 layers HASL : 0.6mm ~ 3.2mm  
OSP / Immersion Gold/Tin/Sliver : 0.40 mm~3.2 mm  
4 Layers Min: 0.6 mm  
6 layers Min: 0.8 mm  
8 layers Min: 1.0mm  
Finished  Board Thick tolorance ≤1.0mm : +/-0.1mm /
>1.0 mm : +/-10% /
Copper Thickness inner layer Min : 1/2oz  ,  Max : 4 oz 4 oz < thickness  ≤5oz  OR  Asymmetric copper
outer layer Min : 1oz  ,  Max: : 4 oz 4 oz < thickness  ≤5oz
Surface Treatment and thickness HASL Pad size < 20 mm x 20mm : 2-40 um /
Pad size ≥ 20 mm x 20mm : 0.4-40 um /
OSP 0.2-0.5um /
Immersion Silver 0.2-0.4um /
Immersion Tin 0.8-1.5um /
Immersion Gold Au:0.025-0.075um; Ni : 3-8um Au:0.075-0.127um; Ni:3-8um
Gold finger / Au:0.1-1.27um
Solder mask Color Green、Black、White、Yellow、Blue、Red、Matte Green、Matte Black、Matter Red、Matter Blue、Purple、Clear、Different color between top and bottum /
Type KSM / PSR2000 / PSR4000/ LB-9000 / PM-500WD-97SF  
bridge min 0.1mm (4mil)  
Silkscreen color Green/ Black/ White/ Yellow/ Blue/ Red/ Matte Green/ Matte Black/ Matter Red/ Matter Blue/ Purple/ Clear/ Gray
Different color between top and bottum
Panel size 600*600(Max) 600*650mm(Max)
Pcs size Min.10mm :With tooling hole (hole size 1.5-5.5mm) /
PCS Count Per Panel 0-100 PCS/SET  
Rate of X-out Single Set ≤20%  
All SET ≤20%  
All PCS ≤4%  
Minimum  Core Thickness 0.1mm(4mil)  
Drill types Drill Groove, Vias with Epoxy, Vias with Soldermask , Press Fit Hole, Castellated Holes,  
Holes Drill Groove Groove width : PTH :Min 0.5mm ; NPTH : Min 0.6 mm  
Vias with Epoxy Min 0.2mm  ,  Max 6.5mm  
Vias with Soldermask Min 0.2mm  ,  Max 0.65mm  
Press Fit Hole Min 0.4mm , Max 1.5mm ; Tolorance :+/- 0.05mm ;          ( Require: 20um ≤ average hole copper thickness≤25um; 1oz  ≤ outer layer copper thickness ≤ 2oz) 1. Hole size > 1.5mm ;                                                                   2. 25um ≤ average hole copper thickness≤30um
Countersink Deepth Tolerance ±6mil  
Angel 82°/ 90°/ 100° ; Angel Tolerance ±10°  
Castellated Holes Min.0.6 mm Min 0.5mm  ,  Max 0.6mm
Aspect ratio ≤8:1 8:1<  Ratio ≤10:1
Hole Copper Thickness (average) Min.20um(0.8mil)  Max 30um(1.2mil) Min.30um(1.2mil)   Max.40um(1.6mil)
Tolorance of Drill size PTH +/- 0.075 mm  
NPTH +/- 0.05 mm  
≥ 6.5mm   +/- 0.15 mm
Hole position tolerances +/- 2 mil /
Inner Via/ Line (Original Gerber) 4 Layers: 6mil ; 6 Layers: 7mi ; 8 Layers :8mil         (Based on 1 oz ,For every extra ounce, add 2mil)  
Outer Via/ Line (Original Gerber) 7 mil  
Holes between Different Networks (Finished) Min: 8 mil  
Holes in the Same Network (Finished) Min: 6 mil  
Inner Line Width/ Space   (Original Gerber) 0.5/0.5 oz:4/4mil;        1/1 oz:4/4mil;                              2   /  2 oz : 6/6mil;       3/3OZ:8/8mil  
Outer Line Width/ Space   (Original Gerber) 1  /  1oz:4/4mil;    1.5/1.5oz:5/5mil;                            2  /  2oz:6/6mil;    2.5/2.5oz:8/8mil;                             3  /  3oz:9/10mil;  3.5/3.5oz:10/11mil;                      4  /  4oz:11/12mil;  
Tolorace of  line Width +/- 20%  
Single Side Width of PAD Ring (Finished) Based copper thick  0.5/0.5 oz Via hole 3mil ; Plug Hole 5mil  
Based copper thick  1/1oz Via hole 5mil ; Plug Hole 6mil  
Based copper thick  2/2oz Via hole 3mil ; Plug Hole 5mil  
Based copper thick  3/3 oz Via hole 5mil ; Plug Hole 6mil  
The Diameter of BGA PAD(Original Gerber) FInished  Copper Thick 1/1 oz HAL 12 mil, Others Min 10 mil  
FInished  Copper Thick 1.5/1.5oz HAL 14 mil, Others Min 12 mil  
Impedance Value And Tolorace Min.50Ω ± 10%  
Groups ≤ 6 >6
Coil Boards                  (No inductance requirement) Copper thick 1oz Min Line width / space :               ENIG  6/6mil;       HAL 8/8mil; (≤8 Loops)  
Copper Thick 2 oz Min Line width / space :               ENIG 8/8mil;    HAL 9/9mil;   (≤8 Loops)  
Guard Ring Width of Inner Layers 8 mil  
Solder Mask Window Single Side Width Min. 2 mil  
Thickness Of Solder Mask 5-25um 1 stratum  
25.1-50um 2  Stratum  or Min  thickness Requirement  
Solder Mask Text Of Different Surface Tratement HAL, Min.0.25mm×0.8mm  
Others, Min.0.2mm×0.8mm  
Width of Solder Mask Bridge Green, Clear 1oz 4mil ; 2oz 5mil ; 3oz 6mil ;  4oz 8mil  
Yellow, Black, Blue, Red, White, 1oz 6mil ; 2oz 7mil ; 3oz 8mil  ; 4oz 10mil  
Matt Green,Matt Blue, Pruple 1oz 6mil ; 2oz 7mil ; 3oz 8mil  ; 4oz 10mil  
Matt Black 1oz 6mil/ 2oz 8mil/ 3oz 10mil/ 4oz 10mil  
Silkscreen text Width / Height 28 x 5 mil  (≥ 6:1)  
Slot Slot size tol.Min.08mm PTH Slot Tolorance: +/-6mil /
NPTH slot Tolorance: +/-5mil
Tolorance OF Outline Dimension ±0.1mm (4 mil) /
Minimum spacing between hole edge to circuitry pattern Inner layer Min.10mil  
Outer layer Min.8mil  
V-cut Board Thickness min0.50mm(20mil).  
Groove Angle 20°,30°,45°,60°  
Groove center to Trace ≥0.4mm  (Board Thickness : 0.5mm -0.6mm)  
Groove center to Trace ≥0.6mm  (Board Thickness : 1.6mm -3.0mm)  
Board Thickness : 0.5mm -0.6mm Remain Thickness: 0.3 +/- 0.10 mm  
Board Thickness : 0.6mm- 0.8mm Remain Thickness: 0.3 +/- 0.10 mm  
Board Thickness : 0.8mm -1.6mm Remain Thickness: 0.4 +/- 0.10 mm  
Board Thickness : 1.6mm -3.2mm Remain Thickness: 0.5 +/- 0.10 mm  
Multilayer Min. board thickness 4layers:0.60mm  

The Future of the PCB Market: Challenges, Opportunities, and Strategies

For the professional Printed Circuit Board Manufacturers, keep updating the new trends of this industry can help us grow faster.

  • The PCB industry is expected to reach USD 19 billion in 2018, a 23% year-on-year growth from 2017. PCB manufacturers are facing various challenges and opportunities, but at the same time, they also have the chance to grab a market share of up to USD 38 billion by 2022.
  • This article will provide you with insights on what the future may hold for PCB manufacturers. undefined Today, the PCB industry is a $66 billion market. A market that is expected to grow even more in the next few years.
  • We will take a look at some of the challenges and opportunities of the PCB industry and how you can position your company to capitalize on these developments.
  • Challenges faced by PCB manufacturers Industry transformation The PCB industry has been facing certain challenges such as increased competition, increase in demand for green products, and changing consumer trends.
The Impact of 3D Printing on PCB Manufacturing

PCBs are printed circuit boards that are being used in a variety of new applications that are utilizing 3D printing.

It is expected that by 2020 the percentage of PCBs exported to China will decrease from 50% to 35%. This means that the PCB manufacturing industry will need to change with the times and transition to 3D printing.

3D printers have been used in manufacturing for decades to make prototypes, but the technology’s price tag and slow speed made it a tough sell for high-volume production. However, new advancements in 3D printing technology are hitting the mainstream just as the manufacturing industry is on the brink of a digital revolution.

For example, companies are beginning to utilize more and more 3D printed components in their products. For instance, the Oak Ridge National Laboratory (ORNL) has a 3D printed car, and GE Aviation is helping build the world’s first 3D printed jet engine. Another domain that is quickly embracing 3D printing technology is the medical sector.

3D printing is also increasingly being used in military applications, from 3D printed drones to 3 D printed grenades. The following infographic from 3D Printing Industry illustrates a few ways 3D printing is changing the world:

But there are also challenges and misconceptions to overcome. The most common is that 3D printing is too expensive, especially for small jobs.

PCB Market Trends 2022

Now is the time to rethink PCB design. With a world population of over 7 billion and expected to grow to over 9 billion by 2050, we are facing unprecedented demands on the environment and resources.

This demands not only new thinking about how we produce our products, but also about how we use them as well. The market for printed circuit boards (PCBs) is undergoing rapid change with increasingly stringent legislation, stringent regulation and global competition from low-cost producers in Asia.

With the recent restructuring of the electronics industry and an increase in mergers and acquisitions, it has become more difficult for PCB suppliers to predict demand patterns in their markets. To stay competitive and profitable, it’s becoming more important than ever to continually invest in research and development.

The PCB market is currently estimated to be worth $90 billion, with a growth rate of 5%, and it’s predicted to be worth $121 billion by 2022.

The largest cost for consumers in PCBs is the materials.
Yet, manufacturing by far has the largest impact on the environment due to its emissions from production facilities. The PCB market is expected to grow to $38 billion by 2022.

This growth will be driven primarily by the needs of IoT and automotive industries, which are projected to account for approximately 50% of the demand.

the EU Emissions Trading Scheme for Printed Circuit Board Manufacturers

The European Union Emissions Trading Scheme (EU ETS) was established in 2005 to combat global warming by reducing carbon emissions. The scheme requires companies that produce more than 25,000 tonnes of CO2 per year to buy emission allowances or enter into a dedicated offsetting scheme.

What are the implications of the EU Emissions Trading Scheme for Printed Circuit Board Manufacturers?

EU ETS has been in place for almost 10 years now, and it has had a significant impact on the PCB industry. Under the EU ETS, industries are allocated emission allowances based on their emissions performance as well as their economic contribution to the EU economy.

The allocation of these allowances is not enough to cover all emissions from companies that operate within the EU. Polluters are then required to purchase credits from other polluting companies or buy them on the market if they can afford to do so.

For the PCB industry and its customers, the EU ETS has had two significant impacts. First of all, it has made the industry more aware of the environmental impact of its products. PCB manufacturers and customers are now thinking more about how to minimize their compliance costs by improving their product design and by substituting old PCBs for a new one.

Secondly, the EU ETS has given the industry an opportunity to invest in new, cleaner technologies. The industry has been working on less polluting alternatives and ways to minimize their use of PCBs over the last few years.

In summary, the EU ETS has led to more efficient use of PCBs and less polluting technology. The EU ETS is expected to have a positive impact on the production of PCBs, by stimulating market demand and providing incentives for cost-effective reductions in emissions.

The EU ETS has already resulted in a small decrease in PCB production capacity, but most of the reduction of installations has taken place in the non-copper-based systems since their emissions are not covered by the EU ETS.

The PCB production capacity for copper-based systems is expected to increase due to the new EU legislation on PCBs, which will require producers of PCBs and PCB equipment to apply for an annual authorization and to report on the quantities produced, imported, and exported.

According to all the companies interviewed for this study, since the EU E TS is a relatively expensive regulation, companies should expect to see more competitive pressure on prices as the supply of PCBs will increase.

The Future of Composites in Electronic Assembly

In recent years, the electronics and semiconductor industry has moved towards more efficient materials for electronic assembly.

This is because carbon composites can be used as an alternative to traditional SMT components. They are more resistant to heat and can withstand higher stresses than metal-based materials, making them a preferred option in high-temperature conditions.

However, they also have some disadvantages. The most significant one is their cost – carbon composites are more expensive than metals and plastics (used in conventional SMT components), which limits their use in volume production. The electronics industry is in the midst of a composites revolution.

The latest designs are incorporating more and more advanced materials, including glass-reinforced epoxy, for improved performance and reliability at lower cost. Glass-reinforced epoxy has long been used in the aerospace industry, where its main advantage is its flexibility.

Other materials being considered include carbon -reinforced organics and even ‘metal-matrix’ composites. Carbon-reinforced composites can improve the performance of a part, as well as decrease weight. Advanced ceramics are also being considered for electronics applications.

Ceramic materials offer high electrical and thermal conductivity at relatively low weight. This technology is still in its early stages, but should be of major interest to aircraft designers in the next few years. The material that has garnered the most attention recently is boron carbide (B4C).

Boron carbide is 10 times as strong as steel and is also heat resistant. It has been used in turbine disks and in the nose-cones of supersonic aircraft, but its use for primary load-bearing components in aircraft has been limited.

The use of boron carbide for primary load-bearing components is very risky and only the application in secondary components will be feasible for some time to come.

Future of the PCB Market: Challenges, Opportunities, and Strategies

The PCB market has been impacted by the increasing cost of manufacturing boards, and competition from new technologies. In order to stay afloat, companies have had to innovate, inventing new ways to produce PCBs more effectively. The PCB market is expected to exceed $45 billion by 2021, but several factors are challenging the future of this industry. Manufacturing has migrated to China and other countries, making it difficult for PCB manufacturers in the US to compete on price. In addition, there has been a fundamental shift in product mix toward smaller-volume products with higher technology content and shorter life cycles, which impacts demand. The future of the PCB market is an interesting topic. As the world’s population grows, new technologies are introduced, and social issues come up – what will happen to the PCB market? There are many challenges, opportunities, and strategies that will change the PCB market in the future. PCB Market Demand

The market demand for PCBs is dependent on many factors. For example, the pace of growth in emerging countries is expected to be stronger than in developed countries. Furthermore, the emergence of new technologies, as well as steady growth in global trade, will impact PCB market demand.Finally, the development of new materials will impact PCBs. Materials such as carbon nanotube have been projected to be a substitute for copper. A recent report from the ITRI, on materials for printed circuit boards, estimates that carbon nanotube will displace 5% of copper demand by 2016. However, it is not feasible to replace copper entirely with carbon nanotube due to its inferior thermal and electrical conductivity. According to a report issued by BCC Research, the global printed circuit boards (PCBs) market will surpass $70 billion in 2025. The report finds that the market will grow at an annual rate of 4.5% over the next 10 years, driven by a surge in demand for multi-layer PCBs, which are expected to increase. The demand for multi-layer PCBs is likely to be driven by the growth in rigid and flexible printed circuit boards market and the consumer electronics industry. The report finds that the emergence of high-end applications will expand multi-layer PCBs ’ penetration in the case of flat PCBs by 2025. “The globalization and economic growth of emerging countries will boost the use of multi- layer PCBs in the coming years,” says Ravi Shankar, a lead analyst at Technavio for electronics research. “The demand for multi-layer PCBs is projected to reach 5.2 million square meters by the end of the forecast period. “The growing demand for high-end electronics and the increasing use of smartphones in emerging economies will propel the growth of multi- layer PCBs market,” says Shank ar. There will be a high demand for smartphones and tablets in the next eight years, which will drive the growth of multi- layer PCBs market .


With the rise of PCB-related business, the manufacturing industry has been growing. However, in order to maintain this growth, manufacturers need to keep up with the development of new technologies and circuits. They also need to be able to meet demand for small production runs. PCB market will continue to be competitive. The key is for the PCB manufacturers to develop strategies that distinguish themselves. Achieving a competitive advantage depends on diversifying and integrating activities with upstream and downstream partners, innovating new materials and processes, investing in R&D, understanding the changing consumer needs and demands, adopting new technologies like IoT, etc.

The Future of PCB Market
The market will be driven by factors such as the demand for IoT enabled devices, advanced data centers and the recently announced 5G network, in addition to the industry trend toward PCB re-use. The market is also influenced by the growth of end-user industries, such as: industrial (automotive, oil and gas, aerospace and defense), transportation, healthcare/medical devices, consumer electronics and IT /telecom. The PCB re-use and recycling market holds huge potential in terms of providing both end-users and producers with additional value.