Professional Service for Trading Companies

Rigid Multilayer PCB Fabrication | Capability 3,850,000ft²

  • Found in 2010, Factory 129,100 ft²
  • 24/7 After-sale Service, 98% On-Time delivery
  • ISO 9001/ ISO 14001 | UL E500302
  • IATF 16949 | RoHS | REACH

Heavy Cooper Board | Board Thickness 0.40 mm~4.0 mm

$ 0 NRE | $ 0 Samples | 30 credit days from the first order

  • Focus on Rigid PCB, FR-4, 0- 12 Layers.
  • Samples  quick turn PCB factory
  • $ 0 NRE for all ≥3 m² new orders and ≥1 m² transferred orders

Minimum Core Thickness 0.1mm(4mil) | Width/ Space 3mil/ 3mil

Multilayer PCB Fabrication
Multilayer PCB Fabrication
Multilayer PCB Fabrication
Multilayer PCB Fabrication

Focus on Multilayer PCB Fabrication Service

Finish all multilayer PCB fabrication processes in-house. 

Headquarters:7 floor, Huachuangda YiJing Building, 45 District,
Bao’an District, Shenzhen, CN
Samples PCB Fabrication:Bld3 Xinda Circuit Science and Technology Park,South of Luyuan Avenue West of Industrial Park, Xinfeng county
Delivery Wearhouse:Tianchen Bld, Xinhe Road, Bao’an District

More about HX Circuit
Board Thickness
0.6mm ~ 4.0mm
OSP / Immersion Gold
0.40 mm~4.0 mm
Board Thickness
1/2 L 0.40 mm~4.0 mm
4 L Min: 0.6 mm
6 L Min: 0.8 mm
8 L Min: 1.0 mm
Copper Thickness
1/2 OZ ~ 5 OZ
1 OZ ~ 15 OZ
Line Width ± 1mil
Board Thickness ±0.1mm
Drill size ±0.05mm
Bow and Twist 0.5%

Things about HX Circuit Multilayer PCB Fabrication

$ 0 NRE

≥1 m² Orders

  • For all ≥3 m² new orders
  • For all ≥1 m² transferred orders.
  • Rigid PCB, FR-4
PCB manufacturer 0 nre
$ 0 Samples

Free Samples

  • 24 hours quick turn
  • Based on Mass production
  • $ 0 Shipping Cost
30 Credit Days

From 1st order

  • For all customers
  • For all orders
  • From the delivery date

On-time delivery

  • Nearby Shenzen Port
  • By Express/ Air/ Sea
PCB MANUFACTURER on time deliverys

7S System

PCB Factory Mgt


On Time Delivery


After-sale Service

0 -12 Layers

Rigid PCB


Large-scale Customers



24 hours

Quick Turn

11 Years+ years


Multilayer PCB Fabrication- circuit board manufacturing capabilities

We are not sure if you have 3 suppliers or more for your PCB items. But, HX Circuit is totally different from the others. If you start from a sample, we are sure you will enjoy our services.

HX can NOT supply you all types of PCB boards. As an experienced rigid PCB board manufacturer, HX Circuit only focuses on FR- 4 materials, bare board to 12 layers.

We just want to be the key supplier on this range. HX Circuit only seeks for long time cooperation, to be one of your Strategic Partners.

Item Rigid PCB Capability
Standard Advanced
Base Material TG135: S1141 , KB6160 (CTI175-249) Halogen free-TG135(CTI175-249)
TG150: KB6165 (CTI175-249) S1141, Rogers RO4003/4350
TG170: S1000-2, KB6167 (CTI175-249) /
Number of  layer 0-12 Layers 10-12Layers
Finished Board Thickness HASL 0.6mm ~ 4.0mm  
OSP / Immersion Gold/ Tin/ Sliver 0.40 mm~4.0 mm  
Finished Board Thickness 1 or 2 layers HASL : 0.6mm ~ 3.2mm  
OSP / Immersion Gold/Tin/Sliver : 0.40 mm~3.2 mm  
4 Layers Min: 0.6 mm  
6 layers Min: 0.8 mm  
8 layers Min: 1.0mm  
Finished  Board Thick tolorance ≤1.0mm : +/-0.1mm /
>1.0 mm : +/-10% /
Copper Thickness inner layer Min : 1/2oz  ,  Max : 4 oz 4 oz < thickness  ≤5oz  OR  Asymmetric copper
outer layer Min : 1oz  ,  Max: : 4 oz 4 oz < thickness  ≤5oz
Surface Treatment and thickness HASL Pad size < 20 mm x 20mm : 2-40 um /
Pad size ≥ 20 mm x 20mm : 0.4-40 um /
OSP 0.2-0.5um /
Immersion Silver 0.2-0.4um /
Immersion Tin 0.8-1.5um /
Immersion Gold Au:0.025-0.075um; Ni : 3-8um Au:0.075-0.127um; Ni:3-8um
Gold finger / Au:0.1-1.27um
Solder mask Color Green、Black、White、Yellow、Blue、Red、Matte Green、Matte Black、Matter Red、Matter Blue、Purple、Clear、Different color between top and bottum /
Type KSM / PSR2000 / PSR4000/ LB-9000 / PM-500WD-97SF  
bridge min 0.1mm (4mil)  
Silkscreen color Green/ Black/ White/ Yellow/ Blue/ Red/ Matte Green/ Matte Black/ Matter Red/ Matter Blue/ Purple/ Clear/ Gray
Different color between top and bottum
Panel size 600*600(Max) 600*650mm(Max)
Pcs size Min.10mm :With tooling hole (hole size 1.5-5.5mm) /
PCS Count Per Panel 0-100 PCS/SET  
Rate of X-out Single Set ≤20%  
All SET ≤20%  
All PCS ≤4%  
Minimum  Core Thickness 0.1mm(4mil)  
Drill types Drill Groove, Vias with Epoxy, Vias with Soldermask , Press Fit Hole, Castellated Holes,  
Holes Drill Groove Groove width : PTH :Min 0.5mm ; NPTH : Min 0.6 mm  
Vias with Epoxy Min 0.2mm  ,  Max 6.5mm  
Vias with Soldermask Min 0.2mm  ,  Max 0.65mm  
Press Fit Hole Min 0.4mm , Max 1.5mm ; Tolorance :+/- 0.05mm ;          ( Require: 20um ≤ average hole copper thickness≤25um; 1oz  ≤ outer layer copper thickness ≤ 2oz) 1. Hole size > 1.5mm ;                                                                   2. 25um ≤ average hole copper thickness≤30um
Countersink Deepth Tolerance ±6mil  
Angel 82°/ 90°/ 100° ; Angel Tolerance ±10°  
Castellated Holes Min.0.6 mm Min 0.5mm  ,  Max 0.6mm
Aspect ratio ≤8:1 8:1<  Ratio ≤10:1
Hole Copper Thickness (average) Min.20um(0.8mil)  Max 30um(1.2mil) Min.30um(1.2mil)   Max.40um(1.6mil)
Tolorance of Drill size PTH +/- 0.075 mm  
NPTH +/- 0.05 mm  
≥ 6.5mm   +/- 0.15 mm
Hole position tolerances +/- 2 mil /
Inner Via/ Line (Original Gerber) 4 Layers: 6mil ; 6 Layers: 7mi ; 8 Layers :8mil         (Based on 1 oz ,For every extra ounce, add 2mil)  
Outer Via/ Line (Original Gerber) 7 mil  
Holes between Different Networks (Finished) Min: 8 mil  
Holes in the Same Network (Finished) Min: 6 mil  
Inner Line Width/ Space   (Original Gerber) 0.5/0.5 oz:4/4mil;        1/1 oz:4/4mil;                              2   /  2 oz : 6/6mil;       3/3OZ:8/8mil  
Outer Line Width/ Space   (Original Gerber) 1  /  1oz:4/4mil;    1.5/1.5oz:5/5mil;                            2  /  2oz:6/6mil;    2.5/2.5oz:8/8mil;                             3  /  3oz:9/10mil;  3.5/3.5oz:10/11mil;                      4  /  4oz:11/12mil;  
Tolorace of  line Width +/- 20%  
Single Side Width of PAD Ring (Finished) Based copper thick  0.5/0.5 oz Via hole 3mil ; Plug Hole 5mil  
Based copper thick  1/1oz Via hole 5mil ; Plug Hole 6mil  
Based copper thick  2/2oz Via hole 3mil ; Plug Hole 5mil  
Based copper thick  3/3 oz Via hole 5mil ; Plug Hole 6mil  
The Diameter of BGA PAD(Original Gerber) FInished  Copper Thick 1/1 oz HAL 12 mil, Others Min 10 mil  
FInished  Copper Thick 1.5/1.5oz HAL 14 mil, Others Min 12 mil  
Impedance Value And Tolorace Min.50Ω ± 10%  
Groups ≤ 6 >6
Coil Boards                  (No inductance requirement) Copper thick 1oz Min Line width / space :               ENIG  6/6mil;       HAL 8/8mil; (≤8 Loops)  
Copper Thick 2 oz Min Line width / space :               ENIG 8/8mil;    HAL 9/9mil;   (≤8 Loops)  
Guard Ring Width of Inner Layers 8 mil  
Solder Mask Window Single Side Width Min. 2 mil  
Thickness Of Solder Mask 5-25um 1 stratum  
25.1-50um 2  Stratum  or Min  thickness Requirement  
Solder Mask Text Of Different Surface Tratement HAL, Min.0.25mm×0.8mm  
Others, Min.0.2mm×0.8mm  
Width of Solder Mask Bridge Green, Clear 1oz 4mil ; 2oz 5mil ; 3oz 6mil ;  4oz 8mil  
Yellow, Black, Blue, Red, White, 1oz 6mil ; 2oz 7mil ; 3oz 8mil  ; 4oz 10mil  
Matt Green,Matt Blue, Pruple 1oz 6mil ; 2oz 7mil ; 3oz 8mil  ; 4oz 10mil  
Matt Black 1oz 6mil/ 2oz 8mil/ 3oz 10mil/ 4oz 10mil  
Silkscreen text Width / Height 28 x 5 mil  (≥ 6:1)  
Slot Slot size tol.Min.08mm PTH Slot Tolorance: +/-6mil /
NPTH slot Tolorance: +/-5mil
Tolorance OF Outline Dimension ±0.1mm (4 mil) /
Minimum spacing between hole edge to circuitry pattern Inner layer Min.10mil  
Outer layer Min.8mil  
V-cut Board Thickness min0.50mm(20mil).  
Groove Angle 20°,30°,45°,60°  
Groove center to Trace ≥0.4mm  (Board Thickness : 0.5mm -0.6mm)  
Groove center to Trace ≥0.6mm  (Board Thickness : 1.6mm -3.0mm)  
Board Thickness : 0.5mm -0.6mm Remain Thickness: 0.3 +/- 0.10 mm  
Board Thickness : 0.6mm- 0.8mm Remain Thickness: 0.3 +/- 0.10 mm  
Board Thickness : 0.8mm -1.6mm Remain Thickness: 0.4 +/- 0.10 mm  
Board Thickness : 1.6mm -3.2mm Remain Thickness: 0.5 +/- 0.10 mm  
Multilayer Min. board thickness 4layers:0.60mm  

The Best Multilayer PCB Fabrication Options

HX Circuit is an expert in Multilayer PCB Fabrication.  As a professional Rigid PCB Manufacturer and Servicer, HX Circuit only focuses on mass production, FR- 4, 0- 12 layers.

  • PCB fabrication is the term for all of the processes that must be completed in order to create a printed circuit board (PCB).
  • There are several steps involved in PCB fabrication, including designing the board and printing it onto metal sheets using a chemical transfer process.
  • This article tells you everything you need to know about multilayer PCB and what the benefits of them are!
What is PCB Fabrication?

PCB fabrication is a process that takes electronic circuit designs and turns them into the physical materials. This process can be broken down into three main parts: CAD design, PCB layout, and PCB fabrication.

  • The first step in the manufacturing process is to create a physical layout on a computer chip of where all the circuits will go according to your design.
    This data is then sent to a fabricator who sends back the finished product.
  • PCB fabrication refers to the process of producing PCBs. This process is complicated and many factors can lead to error or failure. These include how early you start with testing and designing, what your buyer’s standards are, and the materials that are used.
  • In general, the earlier you start with testing and design, the better because this gives you more time to tweak plans. PCB Fabrication is the process of designing a circuit board and then fabricating it.
  • This design process can be either done on a computer with a software package or by hand. There are plenty of PCB Fabrication options out there, but it is important to have quality material and attention to detail when designing the circuit board.
  • When designing a circuit board, common mistakes can include cutting corners and trusting that the design process will ensure that it is safe. The best way to avoid this issue is to have experts on the job and always use board testing.
  • The art of circuit board design and fabrication is one that involves a lot of careful attention to detail and the fine line between what works and what doesn’t work.
  • Please noted HX Circuit only focuses on FR-4 materials.
Benefits of Multilayer PCB

It’s important to note the benefits of multilayer PCB when considering a fabrication plan.

This type of fabrication has grown in popularity because it’s an inexpensive way to create different layers in order to minimize interference between electronics systems and circuit boards.

Cost is not the only benefit of this type of fabrication. The following are some other advantages:
– Less time is needed for assembly and programming because the PCBs can be completed by professionals

– Accurate positioning between components and circuits helps manage electromagnetic interference

– You can provide more space for further circuits when placing components in separate layers Multilayer PCBs have many benefits, including easier routing and production of double-sided boards.

When using these boards, it is easier to create circuits with more layers.

  • This reduces the risk of electromagnetic interference because there are fewer cables in close proximity to each other.
  • Multilayer boards also help reduce overall costs because you can use a single substrate for certain components that might be frequently used. Multilayer PCBs are an excellent choice for the people who need more than just one level of connectivity.
  • If you want to stack multiple boards on top of each other, then this is your best option. A regular board can only provide four connections per side, but a multilayer board can have hundreds. This is also good if you need to dissipate heat efficiently.

There are many reasons why it’s a good idea to use multilayer PCBs. Some of these include:

  • The increased number of layers helps to ensure that the board is more durable and will last longer.
  • The flexibility of multilayer PCBs makes it easy to use them in any design with ease.
  • This is especially useful for the production of professional boards in high volumes. It also gives you the ability to easily find a good supplier who specialises in this kind of work.
  • You can get great results from a multilayer board without resorting to multiple boards. The multilayer board is also easier to use in most cases, which means that you can get a great result.
  • It also makes it easier to get the right kind of results quickly. These boards are more expensive when compared to single-layer boards. They are also more expensive than single-sided boards.
Fused Deposition Modeling (FDM)

FDM is a 3D printing technology that uses a filament to create objects.

  • It typically prints items using a material called thermoplastics. FDM printers are usually very affordable and quick, but they suffer from the downside of limited design options.
  • Fused deposition modeling (FDM) is a model of 3D printing that is based on the idea that the layers are fused together by heating the thermoplastic material.
  • This technology can be used to create layers that have a variety of thickness and compositions. The heated, extruded thermoplastics are layered to create a solid object.
Stereolithography (SLA)

SLAs are best known for the ability to produce parts of any shape and size.

  • Parts can be made in a range of plastics, including acrylic, polyurethane and polyester.
  • This process uses a laser light to solidify a pool of liquid photopolymer resin on top of a layer of UV-sensitive polymer resin.
  • Stereolithography (SLA) is a 3D printing process that uses lasers to draw a pattern on a photopolymer resin surface.
  • The laser controls the polymerization of the resin layer by layer while it is drawn out of the vat. This process can be repeated up to 20 times per second, making it one of the fastest in the industry.
  • However, SLA is not a cheap process and requires an expensive machine and specialized build environment.
Lamination Process

Lamination is a process whereby two or more sheets of material are joined together.

  • This can be done by any number of means including heat, adhesives, ultrasonic welding, lamination molding and so on.
  • The two most common lamination processes are the vapor phase and liquid phase.
  • Lamination is very important for multilayer PCB fabrication. In some ways, the different lamination can decide the different quality of PCB boards.
Directed Energy Deposition (DED)

This technology is typically used to create multilayer PCBs with a large number of layers.

  1. The process involves the object being coated with a layer of metal, which then gets melted. This allows for the direct deposition and patterning of copper on the entire surface.
  2. DED is also known as Electron Beam Additive Manufacturing (EBAM). Deposition System: DED uses a focused laser beam to deposit material onto the substrate. The laser beam can be controlled to create patterns of thickness, making it more cost-effective than other deposition systems.
  3. The laser is first focused onto the substrate, which then turns the material into a vapor. Heated air is then used to direct the vapor towards the substrate. The vapor then condenses onto the substrate and creates the material layer.

Multilayer PCB fabrication is a complex process. All in all, we believe that if you’re a breadboard aficionado with a tight budget and little time to spare, you’ll benefit the most from an online service supplier.

It has plenty of perks for the professional designer as well, but the best thing about it is that there’s no assembly required – simply design your board in minutes and print out your finished product. HX Circuit, focuses on rigid multilayer PCB Fabrication.