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IPC Releases IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC Releases IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards

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August 20, 2015 — IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.  

 

In particular, this standard provides key updates for board designers, specifiers of board materials, fabricators and OEMs who use and keep boards current with base materials used in PCBs. This revision goes further to cover requirements for laminate or prepreg base materials primarily used for rigid and multilayer printed boards for electrical and electronic circuits.

 

"The incorporation of Amendment 1 into IPC-4101D removes the concerns with using revision D of IPC-4101 for all laminates and related prepregs in the fabrication of bare printed boards," said Tom Newton, director of materials at IPC. "This amendment also clarifies the use of earlier revisions when required by customer specification or contract."

 

On top of that, IPC-4101D-WAM1 contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs. The standard also adds table 3-10, Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30.

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